? 2005 california micro devices corp. all rights reserved. 11/08/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 1 CM1441 4-channel emi filter array w/ esd + 4-channel esd array features ? four channels of emi filtering with integrated esd protection ? four channels of esd-only protection ? 0.4mm pitch, 15-bump, 2.360mm x 1.053mm foot- print chip scale package (csp) ? pi-style emi filters in a capacitor-resistor-capacitor (c-r-c) network ? 30kv esd protection on each channel (iec 61000-4-2 level 4, contact discharge) ? 30kv esd protection on each channel (hbm) ? greater than 35db attenuation (typical) at 1 ghz ? chip scale package features extremely low lead inductance for optimum filter and esd performance ? optiguard ? coated for improved reliability at assembly ? lead-free version available applications ? lcd and camera data lines in mobile handsets ? i/o port protection for mobile handsets, notebook computers, pdas etc. ? emi filtering for data port s in cell phones, pdas or notebook computers. ? wireless handsets ? handheld pcs/pdas ? lcd and camera modules product description the CM1441 is a multichannel emi/esd array consist- ing of four low-pass filter + esd channels to reduce emi emissions on data ports and lines and four dedi- cated esd-only channels. each emi filter channel inte- grates a high quality pi-style filter (30pf-100 -30pf) which provides greater than 30db of attenuation in the 800mhz to 2.7ghz frequency range. the parts include avalanche-type esd diodes on every pin, which pro- vide a very high level of pr otection for sensitive elec- tronic components that may be subjected to electrostatic discharge (esd). all esd protection diodes safely dissip ate esd strikes of 30kv, beyond the maximum requirement of the iec61000-4-2 inter- national standard. using the mil-std-883 (method 3015) specification for human body model (hbm) esd, the pins are protecte d for contact discharges at greater than 30kv. this device is particularly well suited for portable elec- tronics (e.g. wireless handsets, pdas, notebook com- puters) because of its small package format and easy- to-use pin assignments. in particular, the CM1441 is ideal for emi filtering and protecting data and control lines for the i/o data ports, lcd display and camera interface in mobile handsets. the CM1441 incorporates optiguard ? which results in improved reliability at assembly. the CM1441 is available in a space-saving, low-profile chip scale package with optional lead-free finishing. it is manu- factured with a 0.40mm pitch and 0.25mm csp solder ball to provide up to 28% board space saving vs. com- peting csp devices with 0.50mm pitch and 0.30mm csp solder ball. 100 30pf 30pf filter+esdn* gnd filter+esdn* 1 of 4 emi/rfi + esd channels. (pins b1-b3) 30pf esdn* 1 of 4 esd-only channels electrical schematic * see package/pinout diagram for expanded pin information. (pins a2-a5) (pins c2-c5) (pins a1, a6, c1, c6)
? 2005 california micro devices corp. all rights reserved. 2 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 11/08/05 CM1441 ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices are specified by using a " + " character for the top side orientation mark. pin descriptions pin(s) name description a1 esd1 esd channel 1 a2 filter1 filter + esd channel 1 a3 filter2 filter + esd channel 2 a4 filter3 filter + esd channel 3 a5 filter4 filter + esd channel 4 a6 esd2 esd channel 2 b1-b3 gnd device ground c1 esd3 esd channel 3 c2 filter1 filter + esd channel 1 c3 filter2 filter + esd channel 2 c4 filter3 filter + esd channel 3 c5 filter4 filter + esd channel 4 c6 esd4 esd channel 4 filter4 esd2 gnd filter4 esd4 a6 a5 orientation marking b3 c6 c5 filter2 filter3 gnd filter2 filter3 a4 a3 b2 c4 c3 esd1 filter1 gnd esd3 filter1 a2 a1 b1 c2 c1 a1 n417 4 3 26 5 1 c b a orientation marking (see note 2) package / pinout diagrams notes: bottom view CM1441-07cs/cp 15 bump csp package (bumps up view) top view (bumps down view) 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side orientation mark. part numbering information bumps package standard finish lead-free finish 2 ordering part number 1 part marking ordering part number 1 part marking 15 csp CM1441-07cs n417 CM1441-07cp n417
? 2005 california micro devices corp. all rights reserved. 11/08/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 3 CM1441 specifications note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gnd, one at a time. note 3: unused pins are left open note 4: these parameters are guarant eed by design and characterization. absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc power per resistor 100 mw dc package power rating 500 mw standard operat ing conditions parameter rating units operating temperature range -40 to +85 c electrical operat ing characteristics (see note1) symbol parameter conditions min typ max units r resistance 80 100 120 c total total channel capacitance at 2.5vdc reverse bias, 1mhz, 30mvac 48 60 72 pf c capacitance c1 at 2.5vdc reverse bias, 1mhz, 30mvac 24 30 36 pf v diode standoff voltage i diode =10 a6.0v i leak diode leakage current (reverse bias) v diode = + 3.3v 0.1 1 a v sig signal clamp voltage positive clamp negative clamp i load = 10ma i load = -10ma 5.6 -1.5 6.8 -0.8 9.0 -0.4 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 level 4 notes 2, 3 and 4 30 30 kv kv r dyn dynamic resistance positive negative 2.3 0.9 f c cut-off frequency z source =50 , z load =50 r=100 , c=30pf 60 mhz
? 2005 california micro devices corp. all rights reserved. 4 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 11/08/05 CM1441 performance information typical filter performance (t a =25c, dc bias=0v, 50 ohm environment) figure 1. insertion loss vs. frequency (a2-c2 to gnd b1) figure 2. insertion loss vs. frequency (a3-c3 to gnd b2)
? 2005 california micro devices corp. all rights reserved. 11/08/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 5 CM1441 performance information (cont?d) typical filter performance (t a =25c, dc bias=0v, 50 ohm environment) figure 3. insertion loss vs. frequency (a4-c4 to gnd b2) figure 4. insertion loss vs. frequency (a5-c5 to gnd b3)
? 2005 california micro devices corp. all rights reserved. 6 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 11/08/05 CM1441 performance information (cont?d) typical diode capacitance vs. input voltage figure 5. filter capacitance vs. input voltage (normalized to capacitance at 2.5vdc and 25c) capacitance (normalized) dc voltage
? 2005 california micro devices corp. all rights reserved. 11/08/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 7 CM1441 application information refer to application no te ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 6. recommended non-solder mask defined pad illustration figure 7. eutectic (snpb) solder ball reflow profile figure 8. lead-free (snagcu) solder ball reflow profile printed circuit boar d recommendations parameter value pad size on pcb 0.240mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.290mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.300mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous (183c) 60 seconds maximum soldering temperature for eutectic devices using a eutectic solder paste 240c maximum soldering temperature for lead-free devices using a lead-free solder paste 260c solder mask opening 0.290mm dia. non-solder mask defined pad 0.240mm dia. solder stencil opening 0.300mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2005 california micro devices corp. all rights reserved. 8 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 11/08/05 CM1441 mechanical details csp mechanical specifications CM1441 devices are supplied in a custom chip scale package (csp). dimensions are presented below. for complete information on csp packaging, see the cali- fornia micro devices csp package information docu- ment. package dimensions for CM1441 chip scale package csp tape and reel specifications figure 9. tape and reel mechanical data package dimensions package custom csp bumps 15 dim millimeters inches min nom max min nom max a1 2.315 2.360 2.405 0.911 0.0929 0.0947 a2 1.008 1.053 1.098 0 .0397 0.0415 0.0432 b1 0.395 0.4000 0.405 0.0156 0.0157 0.0159 b2 0.195 0.2000 0.205 0.0076 0.0078 0.0080 b3 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 b4 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 c1 0.130 0.1800 0.230 0.0051 0.0071 0.0091 c2 0.130 0.1800 0.230 0.0051 0.0071 0.0091 d1 0.575 0.644 0.714 0 .0226 0.0254 0.0281 d2 0.368 0.419 0.470 0 .0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams a b c 3456 c1 b1 a1 b3 c2 dimensions in millimeters d1 d2 a2 bottom view side view 12 b2 b4 0.25 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 CM1441 2.36 x 1.053 x 0.644 2.62 x 1. 12 x 0.76 8mm 178mm (7") 3500 4mm 4mm to p for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o
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